Title:
【発明の名称】オキシランまたはチイラン含有樹脂と硬化剤の再加工可能な組成物
Document Type and Number:
Japanese Patent JP2003529643
Kind Code:
A
Abstract:
A composition useful as underfill sealant for the connection of a semiconductor device to a circuit board is reworkable for more easy separation from the semiconductor device and comprises a curable resin having at least one oxirane or thiirane linkage substituted on at least three of the oxirane or thiirane carbon atoms with an alkyl, alkenyl or aryl substituent along with a curing agent selected from anhydrides, amines, amides, imidazoles, and combinations thereof.
Inventors:
Clemmer Fig, Philip, Tea.
Mesana, Andrew, Dee.
Tres-Philhoe, Afranio
Yager, Erin, Kay.
Takahisa Michibata
Mesana, Andrew, Dee.
Tres-Philhoe, Afranio
Yager, Erin, Kay.
Takahisa Michibata
Application Number:
JP2001572491A
Publication Date:
October 07, 2003
Filing Date:
March 27, 2001
Export Citation:
Assignee:
Henkel Loctite Corporation
International Classes:
C07D301/14; C07D303/28; C07D493/08; C08G59/18; C08G59/20; C08G75/08; C08L63/00; H01L21/56; H01L21/60; (IPC1-7): C08G59/20; C07D301/14; C07D303/28; C07D493/08; C08G75/08; H01L21/60
Attorney, Agent or Firm:
Nobuyuki Kaneda (2 others)