Title:
【発明の名称】熱硬化性樹脂組成物、それを用いてなる複合成形体及び押釦スイッチ用カバー部材
Document Type and Number:
Japanese Patent JP3011642
Kind Code:
B2
Abstract:
Disclosed is a novel thermosetting resin composition suitable for the preparation of an integrally molded two-parts composite body consisting of a first part of a cured silicone rubber and a second part of a cured thermosetting resin without intervention of an adhesive layer at the interface. The thermosetting resin composition comprises: (a) 100 parts by weight of an unsaturated polyester resin; (b) from 20 to 50 parts by weight of an ethylenically unsaturated polymerizable compound such as diallyl phthalate; (c) from 5 to 30 parts by weight of an epoxy resin; (d) from 2 to 20 parts by weight of a melamine resin; (e) from 0.1 to 2 parts by weight of a radical-reactive curing agent which is an organic peroxide; and (f) from 0.1 to 2 parts by weight of an acidic catalyst such as aromatic sulfonic acid derivatives.
Inventors:
Sadao Nakano
Susumu Iwama
Mikio Kiyosawa
Susumu Iwama
Mikio Kiyosawa
Application Number:
JP22347295A
Publication Date:
February 21, 2000
Filing Date:
August 31, 1995
Export Citation:
Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
B32B25/08; C08F283/01; C08L61/20; C08L61/28; C08L63/00; C08L67/06; (IPC1-7): C08G59/40; B32B25/08; C08L67/06; H01H3/12; H01H13/14
Domestic Patent References:
| JP644641A | ||||
| JP660767A | ||||
| JP6181021A | ||||
| JP6309988A | ||||
| JP8283449A | ||||
| JP8333465A |
Attorney, Agent or Firm:
Ryoichi Yamamoto (1 person outside)