To provide an IC card incorporated with a thermoelectric converting device for realizing its long time use without making it necessary to exchange a battery as a power source, and for transmitting and receiving information with the strength of a feeble radio wave, and for preventing its thickness from becoming any obstacle leading to any failure when it is housed or carried and a method for manufacturing the IC card.

This IC card is configured by adhering a first substrate 10 on which a thermoelectric transfoducing device 11 is arranged and a second substrate on which an IC module is arranged, and the thermoelectric transducing device 11 is provided with at least one thermoelectric transducer 11A arranged outside an IC module arrangement region 15 on the first substrate 10 corresponding to the arrangement position of the IC module so that a high temperature part for absorbing heat can be positioned at the IC module arrangement region 15 side.