Title:
IC CARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3358068
Kind Code:
B2
Abstract:
PURPOSE: To provide an IC card and a method for manufacturing it, wherein an IC module is kept from falling off from a card base material and from breaking even when bending stress is exerted on the IC card, and physical reliability is excellent.
CONSTITUTION: A card base material 1 and an IC module 3 embedded in a recess 2 of the card base material 1 are provided. The IC module 3 is provided with an IC chip 10 and a protective body 13 sealing the IC chip 10. The protective body 13 has a groove 14 formed along the outer edge of the IC chip 10. According to this structure, the bottom face of the protective body 13 of the IC module 3 is to be adhered to the recess provided on the card base material 1. Therefore, even if an external force is exerted in the direction to bend the IC card, the adhesion of the recess 2 of the card base material 1 and the protective body 13 of the IC module 3 will not be peeled off and the IC module 3 will not fall off from the card base material 1. Moreover, when the external force is exerted on the IC module 3, the groove 14 provided on the protective body 13 absorbs the external force, so that the IC chip 10 will not be broken physically.
Inventors:
Masanori Kashima
Application Number:
JP25872392A
Publication Date:
December 16, 2002
Filing Date:
September 29, 1992
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B42D15/10; G06K19/077; (IPC1-7): G06K19/077; B42D15/10
Domestic Patent References:
| JP62127293A | ||||
| JP447571U |
Attorney, Agent or Firm:
Shigetaka Awano