To provide an IC card having a favorable appearance under the condition that no unevenness of a recessed part, in which an IC module is placed, emerges on the surface of the card, and its manufacturing method.

On both the sides of a card core sheet 4, over-sheets 3 and 5 are fused under heat. At the predetermined position of the card core sheet 4, a hole 41 for module is bored. By sealing off the hole 41 for module by the over-sheets 3 and 5 on both the sides of the sheet 4, a clearance part 8 is formed. In the clearance part 8, an IC module 6, in which coils 61 and electronic parts 62 such as an IC chip, a capacitor and the like are modularized, is encapsulated, resulting in fully burying the remaining clearance part 8 excluding the part occupied by the IC module with charging resin 7.