IC CARD MANUFACTURING DEVICE AND METHOD

Japanese Patent JP3811047

B2

PROBLEM TO BE SOLVED: To improve the quality and uniformity of an IC card by surely and sufficiently deaerating a laminate base material. SOLUTION: This manufacturing device 1 of an IC card Mi is provided with a laminate base clamp part 2 comprising an upper clamp part 2u and a lower clamp part 2d hermetically sealing by clamping the laminate base M, which interleaves an electronic component P such as an IC chip between a pair of laminates La and Lb, from the both surfaces and a deaeration part 3 deaerating the inside Ri of the laminate base clamp part 2; and manufactures the IC card Mi by heating and pressurizing the laminate base clamp part 2, which is deaerated by clamping the laminate base M. This device is also provided with a deaeration mechanism part 4 which forms an upper deaeration room Ru faced with the upper surface of the upper clamp part 2u and a lower deaeration room Rd, faced with the lower surface of the lower clamp part 2d by clamping the laminate base clamp part 2 from the top/bottom and which deaerates the upper deaeration room Ru and the lower deaeration room Rd by the deaeration part 3.