Title:
IC CARD
Document Type and Number:
Japanese Patent JP2002074299
Kind Code:
A
Abstract:
To prevent an IC chip from being cracked even when an IC card is bent and deformed.
This IC card 11 is provided with a substrate 12 on which an IC chip 15 is mounted, and a terminal substrate 18 is adhered onto the substrate 12 so that the IC chip 15 can be covered, and a recessed part 18a into which the IC chip 15 is fit is formed on one face of the terminal substrate 18, and a terminal 20 for connection is formed on the other face. Thus, the thickness of the terminal substrate 18 can be made thick, and the strength can be increased, and even when the terminal substrate 18 is deformed like a recession, the deformation force can be prevented from being transmitted to the IC chip 15.
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Inventors:
SUGIURA MASAHIRO
HIRATA TATSUYA
WATANABE ATSUSHI
HIRATA TATSUYA
WATANABE ATSUSHI
Application Number:
JP2000262873A
Publication Date:
March 15, 2002
Filing Date:
August 31, 2000
Export Citation:
Assignee:
DENSO CORP
International Classes:
B42D15/10; G06K19/07; G06K19/077; (IPC1-7): G06K19/07; B42D15/10; G06K19/077
Attorney, Agent or Firm:
Tsuyoshi Sato
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