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Patent Searching and Data


Title:
IC CARD
Document Type and Number:
Japanese Patent JPH08187980
Kind Code:
A
Abstract:

PURPOSE: To simplify the structure and assembly of an IC card by welding and bonding firmly a mounting surface of an electronic part of a circuit base and its rear face with a front panel and a back panel.

CONSTITUTION: An exterior of a model is composed of a front panel 10a and a back panel 10b with their three sides folded without using a frame. Folding sections are provided for covering the outer peripheries of a circuit base 3 other than a section to which a connector 4 is connected. At that time, the folding sections of the front panel 10a and the back panel 10b are fixed and connected firmly by the electronic welding or the like. The panels are formed by stainless steel, and the folding sections are formed by a mold. Notches can be formed at the corners of the panels so that the foldings are formed at right angle.


Inventors:
ONODA SHIGEO
MAEDA HAJIME
WASHIDA TETSUO
IKEDA YASUKI
Application Number:
JP130295A
Publication Date:
July 23, 1996
Filing Date:
January 09, 1995
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B42D15/10; G06K19/077; (IPC1-7): B42D15/10; G06K19/077
Attorney, Agent or Firm:
Mamoru Takada (4 outside)