To provide a compact and inexpensive IC card.
An IC and a chip capacitor are mounted on the face of a print coil layer on which a printed coil (a first layer) is formed by etching an aluminum-PET film through using an anisotropic conductive film as an adhesive member. Moreover, a printed coil (a second layer) is formed by etching the aluminum-PET film on the face, and a connection hole is provided at one part of the coil and an escape hole is provided at a position corresponding to the IC and the chip capacitor. Then, a printed coil layer whose back face is coated with adhesive is laminated, and the connection of the printed coils being the first layer and the second layer is operated with a conductive adhesive. At last, a PET film whose upper layer and lower layer are coated with adhesive is laminated.
OSE RYOJI
KADO SEIJI
Next Patent: THIN ELECTRONIC CIRCUIT COMPONENT AND ITS MANUFACTURE AND MANUFACTURING DEVICE