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Patent Searching and Data


Title:
IC CHIP MODULE AND JOINING STRUCTURE THEREOF
Document Type and Number:
Japanese Patent JP2001060744
Kind Code:
A
Abstract:

To make the arranging pitch of the output terminals of an IC chip module, such as the TCP, etc., nearly the same, regardless of the state of the module, whether the state is normal or elongated.

The output terminal sides of a wiring 33 of a TCP (IC chip module) 31 and wiring 34 for power supply are constituted to respectively have first output terminals 33a and 34a for connecting liquid crystal display panel and second output terminals 33b and 34b for display inspection unit. Here, the arranging pitch of the second output terminals 33b and 34b are made equal to that of the terminals 23 for signal and terminals 24 for power supply of a liquid crystal display panel 21. The total arranging pitch of the first output terminals 33a and 34a is made shorter than that of the second output terminals 33b and 34b by a size corresponding to the elongated amount of a film substrate 32 caused by heating.


Inventors:
KATO SHINICHI
Application Number:
JP23532599A
Publication Date:
March 06, 2001
Filing Date:
August 23, 1999
Export Citation:
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Assignee:
CASIO COMPUTER CO LTD
International Classes:
H05K1/02; G02F1/1345; H01L23/12; (IPC1-7): H05K1/02; G02F1/1345; H01L23/12
Attorney, Agent or Firm:
Yoshio Hanawa (1 person outside)