To provide an IC chip mounter wherein the alignment of IC chips is facilitated.
A holding hand 1 is provided with holding portions 2a and 2b which extend in parallel with each other and hold a substrate between them. The holding portions 2a and 2b are supported on a supporting portion 3. The supporting portion 3 is movable in the X-direction along a guide 7 by a cylinder 4a and also movable in the Y-direction by a cylinder 4b. The cylinders 4a and 4b are driven by respective motors 6a and 6b. The supporting portion 3 is also rotatable on the same plane as the holding portions 2a and 2b around the center 5 of rotation located in proximity to the center between both joints with the holding portions 2a and 2b. When the holding hand 1 is positioned in the center of the range of movement thereof in the X-direction, the die 9 of a puncher, a CCD camera 8a for detecting marks formed on an inlet from above, and the laser spot of laser light launched from a laser launching unit 30 are positioned between the holding portions 2a and 2b.
KOJO SEISHI
SHIMONISHI TOSHIYUKI
SHIMOMOTO SEIICHI
UNNO KAZUHIRO
MURAKAMI HIROYUKI
MIYACHI TECHNOS KK
YAMAHA FINE TECH CO LTD