To provide an IC chip supporting film, an IC chip mounting method, and an IC chip mounting body wherein even a small IC chip can be mounted easily and accurately.

The IC chip supporting film 1 is prepared by successively stacking a base material 2, a release layer 3, a transfer foil layer 4, and an adhesive layer 6, wherein a plurality of IC chips 10 are provided on the top side or the bottom side of the layer 4 or in the layer 4 at regular intervals. The IC chip mounting method for mounting the IC chips on the mounting body from the film 1 comprises a step wherein a carrier tape in a rolled state is intermittently sent according to the mounting positions of the IC chips, and a step wherein when the carrier tape is in a stop state, a stamper is pressed and heated from the side of the base material of the carrier tape to peel off the transfer layer and IC chips from the carrier tape through the release layer, whereby the transfer layer and IC chips are mounted on the mounting body.