PURPOSE: To prevent the generation of warps and cracks of a substrate by a method wherein a frame to stop the spreading of a resin which seals semiconductor pellets is provided with inside partitions.

CONSTITUTION: Semiconductor pellets 2-1W2-4 on the substrate 1 are connected with bonding wires 3. The multiseries frame 4 is partitioned with inside partitions 6-1 and 6-2, and therefore the aperture width of a single section is small. Thereby, heating shrinkage of the sealing resin 5 and the inner stress due to the difference in coefficient of thermal expansion between the sealing resin 5 and the substrate 1 can be largely reduced. As a result, the generation of warps and cracks of the substrate 1 is prevented.