Title:
IC MODULE AND ASSEMBLY METHOD THEREOF
Document Type and Number:
Japanese Patent JPS63227394
Kind Code:
A
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Inventors:
KAGAWA KEIICHI
Application Number:
JP6153687A
Publication Date:
September 21, 1988
Filing Date:
March 17, 1987
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/603; B42D15/02; B42D15/10; G06K19/00; G06K19/077; H01L21/60; (IPC1-7): B42D15/02; G06K19/00; H01L21/603
Attorney, Agent or Firm:
Toshio Nakao