Title:
IC MODULE STRUCTURE OF IC CARD OR TAG WITH CONTACT TERMINAL
Document Type and Number:
Japanese Patent JP2007004459
Kind Code:
A
Abstract:
To provide the IC module structure of an IC card or a tag with a contact terminal, which can resist bending shock or stress from the contact terminal side even in the case of a thin type IC card or a tag.
In the IC module structure of the IC card or the tag with the contact terminal, which is constituted of an IC chip 3 and the contact terminal 2; the IC chip 3 is mounted on the contact terminal 2 through a reinforcing plate 6 constituted of stainless steel with 0.01-0.1mm thickness, having an area not less than the contact area of the IC chip 3 and having an insulating adhesive resin 7 on both the surfaces on the mounting side of the IC chip 3 on the contact terminal 2.
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Inventors:
SETO KAZUHIRO
AKAGI KAZUYOSHI
SATO TAKASHI
AKAGI KAZUYOSHI
SATO TAKASHI
Application Number:
JP2005183521A
Publication Date:
January 11, 2007
Filing Date:
June 23, 2005
Export Citation:
Assignee:
NEC TOKIN CORP
International Classes:
G06K19/077; B42D15/10; G06K19/07
Domestic Patent References:
| JPS63290795A | 1988-11-28 | |||
| JP2002123809A | 2002-04-26 | |||
| JPH0212875A | 1990-01-17 |
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