To provide an IC package apparatus that achieves excellent input reflection characteristics by adjusting input impedance to a specific resistance value over a wide bandwidth from DC to a high frequency in an IC package apparatus used also for the processing of a high-frequency signal.

The IC package apparatus has a first strip line 1 that is formed on a package board PB, extends from a package input terminal PT, and has one end that is connected by an input terminal pad 4 and a bonding wire 6, and a second strip line 7 whose one end is connected to the other of the first strip line 1 and whose end section is connected to a soldering electrode 13 where a chip resistor 12 of a terminating resistor is connected. The characteristic impedance of the second strip line is set larger than a characteristic impedance of 50 Ω in the first strip line. The soldering electrode is apart from the connection section of the bonding wire in the first strip line by a specific distance.