To provide an IC seal manufacturing device for attaching an IC chip to a conventional object in which embedding is difficult in a device for manufacturing a seal including an electronic circuit chip such as an integrated circuit chip.

This manufacturing device is provided with a cutting device (B10200) for cutting a sheet (B) 1300 having a plurality of sets of an IC chip 1100 and communication equipment 1200 for each set of an IC chip and communication equipment, a thermal adhering device 11100 for adhering the cut sheet (B) to a sheet (A) 1300 having an adhesive surface and a cutting device (A) 10200 for cutting the sheet (A) with the sheet (B) attached thereto, and the cut sheet (A) is taken out as an IC seal. This solves the problems that material to be embedded is limited to a portion of material, such as plastic in the current IC chip built-in technology, and that an IC chip built-in product generally has already had a built-in IC chip at the time of shipping so that it is difficult for a user to incorporate an IC chip when the IC chip is required to be incorporated in a certain object.