IC SOCKET AND ASSEMBLING METHOD OF IC SOCKET

Title:

IC SOCKET AND ASSEMBLING METHOD OF IC SOCKET

Document Type and Number:

Japanese Patent JP3282793

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To electrically connect both to each other, without making a printed circuit board correspond to the interval, even if a terminal interval of an IC package is narrowed by arranging an expanding means to expand an adjacent other end part side interval between respective contact pins up to a prescribed interval.
SOLUTION: At the assembling of an IC socket 11, for contact pins 19 projecting downward from a first pitch converter 41, an interval between the adjacent respective contact pins 19 is expanded by being guided and inserted up to through-holes 42d, while expanding an interval along an inclined face of this guide projecting part 42e by contacting with the guide projecting part 42e of a second pitch converter 42. Thus, a large number of wiring can be inserted between these through-holes in a printed circuit board, since an interval between respective contact pin connecting parts (through-holes) in the printed circuit board can be expanded by expanding an interval between the respective contact pins 19 on the printed circuit board connecting side.

Inventors:

Kentaro Mohri

Application Number:

JP34698897A

Publication Date:

May 20, 2002

Filing Date:

December 02, 1997

Export Citation:

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