Title:
IC SOCKET AND ITS ELECTRICAL CONTACT
Document Type and Number:
Japanese Patent JPH07287048
Kind Code:
A
Abstract:
PURPOSE: To connect a BGA(Ball Grid Array) type package IC and its reliable IC socket with an improved electrical contact.
CONSTITUTION: An IC socket is provided with a contact means 19 consisting of a metal electrical contact 10 and an elastic rubber 20. When a bump 30 is pressed against the electrical contact 10, the bump 30 receives the elastic force of a metal plate and the elastic rubber 20 and generates wiping operation in reference to a contact part 17 of the electrical contact 10 and at the same time is electrically and mutually connected.
Inventors:
TAKENAKA NORIAKI
KUROKAWA NORIHARU
SASAKI TAKINORI
KUROKAWA NORIHARU
SASAKI TAKINORI
Application Number:
JP10474194A
Publication Date:
October 31, 1995
Filing Date:
April 19, 1994
Export Citation:
Assignee:
AMP JAPAN
International Classes:
G01R1/04; H01L23/32; H01R33/76; G01R31/26; (IPC1-7): G01R31/26; H01L23/32; H01R33/76
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