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Patent Searching and Data


Title:
IC SOCKET
Document Type and Number:
Japanese Patent JPS5927555
Kind Code:
A
Abstract:

PURPOSE: To entirely eliminate improper contacts in an IC socket by opening only upper portion of a container and closing the lower portion, thereby eliminating works of coating adhesive or the like and drying it.

CONSTITUTION: A container which is opened only at the upper portion and closed at the lower portion is provided on the upper surface of a housing 1, a passage 3 is partitioned by a partition wall 4 in parallel with the container 2, and a through hole which elevationally passes is opened. The container 2 contains the contact 5a of a terminal 5. The passage 3 passes the riser 5b of the terminal 5 and leads the leg 5c to the lower surface of the housing 1. In this manner, it prevents flux in case of soldering from flowing into the container 2, and the leg 5c is projected from the lower surface of the housing 1. The leg 5c is inserted into the hole Pa opened at the substrate P and both are soldered at the lower surface of the substrate P so as to connect the substrate P.


Inventors:
IGUCHI JIYUNNOSUKE
Application Number:
JP13653782A
Publication Date:
February 14, 1984
Filing Date:
August 05, 1982
Export Citation:
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Assignee:
TAIKO DENKI CO LTD
International Classes:
H01L23/32; H01R33/76; (IPC1-7): H01L23/32
Domestic Patent References:
JPS5614490U1981-02-07
Foreign References:
US3646504A1972-02-29
Attorney, Agent or Firm:
Yoneya Takeshi