To provide an IC tag label for preventing an adhesive from being forced out when an IC tag label is stuck to an adherend, or preventing the IC tag label from being caught by an obstacle and a method for manufacturing the IC tag label.

A transparent or translucent protection film 7 is stuck from the upper face side each of a plurality of IC tags 3 so that the plurality of IC tags 3 stuck to the peeled face of a band-shaped release paper 5 can be completely covered. Each protection film 7 is shaped so as to be relatively larger than the IC tag 3, and so as to be smaller than the release paper 5, and so as not to be overlapped with the protection film 7 of the adjacent IC tag 3. Also, adhesion processing is performed to the face of the protection film 7 which is into contact with the IC tag 3 and the release paper 5 so that the IC tag 3 can be stuck to the adherend.