To provide an IC tag with a rubber cover such that an IC tag and a rubber cover can be integrated together regardless of the heatproof temperature of the IC tag used and that there are no such problems as limitations on molding method, adhesion reliability, high costs, as in conventional cases.

The IC tag 10 with a rubber cover comprises an IC tag 1 and a rubber cover 2 for covering the IC tag 1. A porous element 3 is positioned between the IC tag 1 and the rubber cover 2. The IC tag with the rubber cover is obtained by vulcanizing the IC tag 1 held between two or more unvulcanized rubber sheets via the porous element 3.