To provide an IC wafer and IC chip with an enhanced bonding strength of a metal bump with respect to an IC terminal.

In the IC wafer divided into individual IC chips 1 with an IC terminal 5 on one main face, the IC terminal 5 is configured to have a dummy terminal for inspection connected electrically thereto. For example, the dummy terminal is coplanar to the one main face forming the IC terminal, and is formed inside an area of the IC chip. Alternatively, the dummy terminal is coplanar to the one main face forming the IC terminal, and is formed outside the area of the IC chip, and also a portion outside the area of the IC chip is cut away when the IC wafer is divided into the individual IC chips. Alternatively, the dummy terminal is formed on another main face from the one main face of the IC chip by a feedthrough electrode.