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Title:
ID BLADE
Document Type and Number:
Japanese Patent JPS63212470
Kind Code:
A
Abstract:

PURPOSE: To minimize warp or saw mark of an ID blade and to ensure cutting quality by jointing an electrodeposition diamond abrasive grain layer having predetermined cutter depth to the inner circumferential edge of a galvanized metal layer having predetermined depth which covers circular inner circumferential section of a core metal.

CONSTITUTION: A galvanized metal layer 23 having depth reducing gradually toward the outer circumferential direction of an ID blade covers circular inner circumferential section of a core metal 1. A diamond abrasive grain layer 24 having predetermined depth is deposited onto the inner circumferential edge of the galvanized metal layer 23 to prepare a desired ID blade. Here, the metal layer 23 is homogeneous and there is no local point on both side faces where the stress is not uniform, thereby ID blade does not bend nor warp and insufficient cutting quality can be avoided. Furthermore, since the metal layer 23 and the abrasive grain layer 24 are narrow,contacting area of cutting material with cutting face is reduced thereby unnecessary friction is reduced and occurrence of saw mark can be suppressed.


Inventors:
TAKAHASHI MASARU
Application Number:
JP4387887A
Publication Date:
September 05, 1988
Filing Date:
February 26, 1987
Export Citation:
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Assignee:
ASAHI DIAMOND IND
International Classes:
B24D3/00; B24D3/06; B24D5/12; B28D5/00; B28D5/02; H01L21/304; (IPC1-7): B24D3/00; B24D3/06; B24D5/12; H01L21/304
Attorney, Agent or Firm:
Hideo Dobashi



 
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