To cool a circuit board by using an air flow having reduced suspended matter such as paper powder or dust.
The image forming apparatus includes: a space 100 for substrate arrangement partitioned from an image forming space and a paper feeding space, and formed between a wall part and a cover member 112 facing to the wall part; the circuit board 120 arranged in the state where a plurality of elements are faced to a surface on the cover member 112 side in the space 100 for substrate arrangement; an intake port 102 at least a part of which is positioned on the downside more than a lower side end 121 of the circuit board 120, provided on the wall part side more than the circuit board 120, and opened so that intake air is blown toward the cover member 112; an exhaust port 104 at least a part of which is opened on the upside more than an upper end of an element positioned on the uppermost part, and provided on the cover member 112; and an intake means for sucking the air in the paper feeding space, and blowing the air from the intake port 102 toward the cover member 112 to send the air to the exhaust port 104.
NISHIDA MASAYOSHI
JPH11153939A | 1999-06-08 | |||
JP2008070744A | 2008-03-27 | |||
JP2007286260A | 2007-11-01 | |||
JP2009198994A | 2009-09-03 | |||
JPH08262960A | 1996-10-11 | |||
JP2005037704A | 2005-02-10 | |||
JP2000293076A | 2000-10-20 |
Takeshi Senda
Takefusa Kubo
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