To obtain an image pickup device capable of being miniaturized by increasing the package density of electric components or the like to be mounted on circuit boards.

A 1st circuit board 8 and a 2nd circuit board 9 with electric components 11a and 11b, and 11c respectively mounted on them on their component sides opposite to a rear side of a solid-state image pickup element 4 are placed in this image pickup device 1A assembled in a tip 49 of an electronic endoscope. In this case, the two circuit boards 8, 9 are laid out at a distance equivalent to nearly the height of the electric components 11a, 11b, 11c by mounting the electric components 11a, 11b on the 1st circuit board 8 with a room for the electronic component 11c so that the electric component 11c mounted on the 2nd circuit board 9 is laid out in the room thereby mounting the electric components with high density.