Title:
イメージセンサー用基板
Document Type and Number:
Japanese Patent JP7345548
Kind Code:
B2
Abstract:
A substrate for an image sensor according to an embodiment includes an insulating layer; and a conductive pattern portion disposed on the insulating layer, wherein the insulating layer comprises: a first insulating part; and a second insulating part surrounding the first insulating part and spaced apart from the first insulating part with an open region therebetween, wherein the conductive pattern portion comprises a first lead pattern part disposed on the first insulating part; a second lead pattern part disposed on the second insulating part; and an extension pattern part disposed on the open region of the insulating layer to connect the first lead pattern part with the second lead pattern part and including a bent portion.
Inventors:
Park, Dakhun
Baek, Jihun
Song, Yong Jun
Baek, Jihun
Song, Yong Jun
Application Number:
JP2021527093A
Publication Date:
September 15, 2023
Filing Date:
November 14, 2019
Export Citation:
Assignee:
LG Innotek Company Limited
International Classes:
G03B17/02; G03B5/00; G03B30/00; H04N23/50
Domestic Patent References:
| JP62134992A | ||||
| JP2008203402A |
Foreign References:
| WO2017156462A1 | ||||
| KR1020180081087A |
Attorney, Agent or Firm:
Makoto Ono
Kennori Kanayama
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Yoshie Sakurada
Yosuke Kawasaki
Youichi Iino
Yusuke Ichikawa
Yoshikazu Iwase
Kennori Kanayama
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Yoshie Sakurada
Yosuke Kawasaki
Youichi Iino
Yusuke Ichikawa
Yoshikazu Iwase