PURPOSE: To obtain a high-reliability and small-sized image sensor by a small number of production processes and at a high yield by a method wherein a wiring part used to drive a board having a photodetector is constituted of an electrode pattern on the board and of a bonding wire without using a multilayer interconnection.

CONSTITUTION: Sixteen pieces each of photodetectors 3 are connected to one IC 6; eight pieces each of driving wiring parts 8a to 8h are connected to each IC 6. A data, used to select a picture element, from the driving wiring parts 8a to 8h is applied to the IC 6 via bonding wires 7a to 7h. The IC 6 selects a photodetector 3 on the basis of the data. A photoelectrically converted output of the selected photodetector 3 is read out at the outside. The bonding wires 7a to 7h are made by an ordinary wire bonding process. Therefore, a high- temperature process for a conventional multilayer interconnection is not required. Accordingly, there is no danger that the photodetector 3 is affected badly by a high temperature; reliability is enhanced.