Title:
撮像装置および撮像装置の製造方法
Document Type and Number:
Japanese Patent JP7260483
Kind Code:
B2
Abstract:
To improve strength of an imaging module with an adjusted optical axis. An imaging device includes an imaging module and a holding unit. The imaging module provided in the imaging device includes an imaging element that images incident light introduced from an upper surface of a housing. The holding unit provided in the imaging device surrounds and holds a side surface of the imaging module, the side surface being adjacent to the upper surface of the housing. The holding unit surrounds and holds the side surface of the imaging module, thereby protecting the imaging module.
Inventors:
Tokunaga Junichi
Yuji Kishigami
Noboru Kawabata
Yoshihiro Nabe
Yuji Kishigami
Noboru Kawabata
Yoshihiro Nabe
Application Number:
JP2019558063A
Publication Date:
April 18, 2023
Filing Date:
October 25, 2018
Export Citation:
Assignee:
Sony Semiconductor Solutions Corporation
International Classes:
G03B17/02; G02B7/02; G03B19/07; G03B30/00; G03B35/08; H04N23/45; H04N23/50; H04N23/57
Domestic Patent References:
| JP2014174551A | ||||
| JP2016174218A |
Foreign References:
| CN206629149U | ||||
| KR101132209B1 | ||||
| KR1020130061322A | ||||
| WO2017179445A1 |
Attorney, Agent or Firm:
Kenichiro Matsuo
Yasuo Ichikawa
Yasuo Ichikawa