Title:
撮像装置
Document Type and Number:
Japanese Patent JP7210267
Kind Code:
B2
Abstract:
An image pickup apparatus that is capable of efficiently dissipating heat generated in a sensor substrate or a control substrate. An image sensor is implemented on the sensor substrate. A first heat dissipation section has four faces approximately parallel to an optical axis of an image pickup optical system of a lens unit and is fixed to the lens unit so that the four faces will surround the optical system from four sides. The control substrate is thermally coupled with the first heat dissipation section. A second heat dissipation section is arranged at a side opposite to the optical system in an optical axis direction with respect to the sensor substrate and is fixed to the first heat dissipation section. A heat conduction member is arranged between the sensor substrate and the second heat dissipation section in the optical axis direction so as to contact the both.
Inventors:
Yuya Fujiwara
Yoshinobu Shibayama
Koichi Shigeta
Masato Ito
Yuya Nagata
Yoshinobu Shibayama
Koichi Shigeta
Masato Ito
Yuya Nagata
Application Number:
JP2018241271A
Publication Date:
January 23, 2023
Filing Date:
December 25, 2018
Export Citation:
Assignee:
Canon Inc
International Classes:
G03B17/02; G03B17/55; H04N23/50; H04N23/52
Domestic Patent References:
| JP2014130205A | ||||
| JP2014095825A | ||||
| JP2009105478A | ||||
| JP7264450A | ||||
| JP2013201567A | ||||
| JP2012070272A |
Foreign References:
| US20160374190 |
Attorney, Agent or Firm:
Another role