Title:
撮像装置
Document Type and Number:
Japanese Patent JP7391644
Kind Code:
B2
Abstract:
Provided is an imaging device that makes it possible to reduce increases in temperature in imaging elements. The imaging device 201 comprises: a housing 1a; imaging elements 2a, 2b accommodated in the housing 1a; circuit elements 6-8 accommodated in the housing 1a; first heat transfer members 110a, 110b that connect the imaging elements 2a, 2b and the housing 1a and transfer heat; and a second heat transfer member 190 that connects the circuit elements 6-8 and the housing 1a and transfers heat. The imaging device 201 is characterized in that the first heat transfer members 110a, 110b are connected to the housing 1a at first connection sections 111a, 111b in the housing 1a and the second heat transfer member 190 is connected to the housing 1a at a second connection section 191 in the housing 1a.
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Inventors:
Morikazu Kato
Hidenori Shinohara
Keisuke Masuda
Takeshi Haga
Hidenori Shinohara
Keisuke Masuda
Takeshi Haga
Application Number:
JP2019221958A
Publication Date:
December 05, 2023
Filing Date:
December 09, 2019
Export Citation:
Assignee:
Hitachi Astemo, Ltd.
International Classes:
H04N23/52; G03B17/02; G03B17/55; H04N23/50; H05K7/20
Domestic Patent References:
| JP2016014564A | ||||
| JP2010130571A | ||||
| JP2019087775A |
Attorney, Agent or Firm:
Patent Attorney Corporation Hiraki International Patent Office