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Patent Searching and Data


Title:
IMC MOLDING METHOD
Document Type and Number:
Japanese Patent JP2005014306
Kind Code:
A
Abstract:

To provide a new IMC molding method capable of enhancing the interlaminar bonding properties of a base material resin layer and a clear resin to enhance the appearance quality or surface properties of a resin molded product.

In the press molding of the resin molded product, a mold on the surface side of the resin molded product is set to a lower temperature as compared with a mold on the back side of the resin molded product to perform primary press molding and the clear resin is subsequently injected in the mold on the surface side of the resin molded product to be subjected to secondary press molding.


Inventors:
Murai, Daisuke
Shinoki, Kazuhiko
Sawada, Hiroshi
Sakamoto, Makoto
Hasegawa, Atsushi
Application Number:
JP2003000179886
Publication Date:
January 20, 2005
Filing Date:
June 24, 2003
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B29C43/14; B29C43/20; B29K105/06; B29L31/10; (IPC1-7): B29C43/14; B29C43/20