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Patent Searching and Data


Title:
IMIDE OLIGOMER, AND POLYIMIDE RESIN FORMED BY HEAT CURING THE SAME
Document Type and Number:
Japanese Patent JP2013256549
Kind Code:
A
Abstract:

To provide an imide oligomer which is easy to thermoform, which has excellent heat resistance after being heat cured at a low temperature, and which shows a large breaking elongation.

An imide oligomer has three or more molecules per tetramer of 2,3,3',4'-biphenyl tetracarboxylic dianhydride of a non-axisymmetric aromatic acid anhydride, three or more molecules of 1,4-bis(4-aminophenoxy)benzene, and only one or less molecule of 3,4'-diaminodiphenyl ether, 1,3-bis(3-aminophenoxy)benzene or 1,3-bis(4-aminophenoxy)benzene, independently or in the combined state; and the crosslinkable end thereof comprises 4-(methyl ethynyl) phthalic anhydride residue.


Inventors:
NISHINO HIDEO
Application Number:
JP2011225323A
Publication Date:
December 26, 2013
Filing Date:
September 22, 2011
Export Citation:
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Assignee:
NISHINO HIDEO
International Classes:
C08G83/00; C07D209/48; C08F238/00; C08G73/10