To provide an imido-containing photosensitive resin composition developable even with an aqueous weak alkali solution and giving an insulating film having heat and chemical resistances and high insulating property by post- baking and to provide an insulating film and a method for forming the insulating film.
The imido-containing photosensitive resin composition comprises (1) a photosensitive imidosiloxane oligomer which is a reaction product of an imidosiloxane oligomer having a functional group reactive with an epoxy group prepared by reacting 100 mol% tetracarboxylic acid dianhydride with 70-90 mol%, in total, of 10-50 mol% aromatic diamine having a functional group reactive with an epoxy group, 10-70 mol% diaminopolysiloxane and 0-20 mol% heterocyclic aromatic diamine and an epoxy compound having a photosensitive group, (2) an isocyanate having an unsaturated double bond, (3) a photopolymerization initiator and (4) an organic solvent. The amounts of the isocyanate and the photopolymerization initiator are 1-80 pts.wt. and 0.01-30 pts.wt., respectively, based on 100 pts.wt. of the photosensitive imidosiloxane oligomer.
WATANABE YOSHIAKI
SAKURAI HIROYUKI
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