Title:
高効率ＲＦ回路のためのインピーダンス整合伝導構造
Document Type and Number:
Japanese Patent JP7226832
Kind Code:
B2
Abstract:
The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
Inventors:
Fleming Jeb H.
McWessie Kyle
McWessie Kyle
Application Number:
JP2020535102A
Publication Date:
February 21, 2023
Filing Date:
December 31, 2018
Export Citation:
Assignee:
3D GLASS SOLUTIONS,INC
International Classes:
H05K3/10; C03C3/091; C03C3/093; C03C4/04; C03C15/00; H01P3/00; H01P3/08; H01P11/00; H03H3/00; H03H7/38; H05K1/02; H05K1/03; H05K1/11; H05K3/40
Domestic Patent References:
| JP2016528735A |
Foreign References:
| US20170094794 | ||||
| US20150277047 | ||||
| WO2005027605A1 |
Attorney, Agent or Firm:
Hiroki Masaki
Teppei Hirota
Seiji Ozawa
Yusaku Tokai
Horiuchi Makoto
Masako Yamauchi
Shuichi Sonomoto
Akihiro Yamamura
Hiroyuki Tomita
Maki Shinoda
Teppei Hirota
Seiji Ozawa
Yusaku Tokai
Horiuchi Makoto
Masako Yamauchi
Shuichi Sonomoto
Akihiro Yamamura
Hiroyuki Tomita
Maki Shinoda