Title:
インピーダンス測定治具及びインピーダンス測定方法
Document Type and Number:
Japanese Patent JP7221670
Kind Code:
B2
Abstract:
To precisely measure an impedance of a large-scale metal structure.SOLUTION: An impedance measurement device 1A includes: a GND plate 11; a pair of side plates 12 and 13 connected to the GND plate 11; a high-frequency coaxial connector 14 having a first center conductor and a first outer conductor, arranged on the side plate 12, and connected to an impedance analyzer 100; and a high-frequency coaxial connector 15 having a second center conductor and a second outer conductor, and arranged on the side plate 13. A closed circuit is formed in which the power input from the impedance analyzer 100 returns to the impedance analyzer 100 via the first center conductor, a DUT 50, the second center conductor, the second outer conductor, the side plate 13, the GND plate 11, the side plate 12, and the first outer conductor.SELECTED DRAWING: Figure 1
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Inventors:
Hajime Terayama
Haruhiro Horiuchi
Shingo Tanaka
Haruhiro Horiuchi
Shingo Tanaka
Application Number:
JP2018230934A
Publication Date:
February 14, 2023
Filing Date:
December 10, 2018
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
G01R27/02
Domestic Patent References:
JP2001281279A | ||||
JP2005189184A | ||||
JP7234256A | ||||
JP6063471A | ||||
JP6117675U | ||||
JP2000230951A |
Attorney, Agent or Firm:
Patent Attorney Corporation Eiko Office