IMPLEMENT FOR PROCESSING ELECTRONIC COMPONENT

Japanese Patent JP3522774

B2

PURPOSE: To obtain a member for manufacturing an electric component which has a high dimensional accuracy, a light weight, excellent chemical resistance and further in which an organic material, etc., is scarcely eluted by forming a contact surface of an implement in contact with an electronic component, its intermediate product or treatment solution of its manufacturing step of thermoplastic saturated norbornane resin.
CONSTITUTION: A contact surface of an implement for processing an electronic component of an implement in contact with the component such as semiconductor, hybrid IC liquid crystal display element, etc., an implement in contact with a wafer, a liquid crystal substrate, or an intermediate product in which a transparent electrode layer or a protective layer is formed thereon and the component, and an implement in contact with treatment solution such as chemicals or superpure water to be used for processing the manufacturing intermediate product in the step of manufacturing the component is formed of thermoplastic saturated norbornane resin. The resin having a mean molecular weight of 10,000-200,000 is preferable. An additive having a charge preventing effect is preferably added. Thus, an excellent member having excellent dimensional accuracy, and resistances against strong acid, strong alkali, etc., is obtained.

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Yukishige, Hidenori
Takahashi, Shinichi
Obara, Teiji
Natsuume, Yoshio

JP10393092A

April 26, 2004

March 31, 1992

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NIPPON ZEON CO LTD

B29D99/00; C08J5/18; C08L23/00; C08L23/02; C08L45/00; C08L65/00; H01L21/304; H01L21/673; H01L21/68; B29K55/00; (IPC1-7): H01L21/68; B29K55:00; C08J5/18; C08L45:00

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