To provide a metal frame for electronic hardware having improved physical mechanical properties including an elastic limit and preferably to provide a highly processable metal frame wherein at least a portion of the frame is made of either a Zr/Ti or Fe-based bulk-solidifying amorphous alloys and bulk-solidifying amorphous alloy-composites, and a method for manufacturing the same.
The metal frame for electronic hardware includes a body having walls defining at least one enclosure wherein the enclosure is designed to at least partially encase at least one electronic component, wherein at least a portion of the body is formed from a bulk-solidifying amorphous alloy material, and wherein the bulk-solidifying amorphous alloy material has an elastic limit of about 1.5% or greater. The bulk-solidifying amorphous alloy is described by the molecular formula: (Zr,Ti)a(Ni,Cu,Fe)b(Be,Al,Si,B)c, wherein "a" is in the range of from about 30 to 75, "b" is in the range of from about 5 to 60, and "c" is in the range of from about 0 to 50 in atomic percentages.
JOHNSON WILLIAM L
| JP2001125099A | 2001-05-11 |
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura
Osamu Shimoyama
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