PURPOSE: To improve the adhesiveness of plating layer by previously subjecting a polyimide base body to a relaxation etching treatment, contacting with a basic soln., and a pretreatment with a cationic surfactant, and further applying a surface treatment with an adhesive intensifying agent thereto, at the time of electroless plating a metal on the surfaces of the base body.
CONSTITUTION: At the time of forming conductive metallic wiring of copper, etc., on the surface of the base body for printed circuit board consisting of a thermoplastic material, such as polyimide, by an electroless plating method, the surface is first cleaned by bringing the surface into contact with a halocarbon material as the pretreatment, then subjecting the surface to the relaxation etching treatment with an aq. sulfuric acid soln. of ≥85wt.% in concn. of a compd., such as N,N-dimethyl formamide. The surface is then brought into contact with an aq. basic soln. of NaOH, etc., of 0.1 to 10mol in concn. and further treated with a water-soluble cationic surfactant, such as stearyl dimethyl benzylammonium bromide, in order to remove the residual film formed on the surface in the relaxation etching stage. Next, the surface is subjected to the surface treatment with an adhesion intensifying agent consisting of a compd., in which >N-O-molecular parts exist, a compd. contg. org double bonds, etc., and thereafter, the base bodies are immersed into an electroless plating liquid of a conductive metal, such as copper, and the electroless copper plating having an excellent adhesion property is formed.
EDOWAADO JIYON RAMUBII
BURATSUDOREI ROSU KARASU
UIRIAMU BINSENTO DEYUMASU
ERIFU KARUBIN JIERABETSUKU
| JPS621877A | 1987-01-07 |