Title:
改善された乾式冶金工程
Document Type and Number:
Japanese Patent JP7273818
Kind Code:
B2
Abstract:
A process for producing a solder product and a copper product from a first lead-tin based metal composition having at least 40% wt of copper and at least 5.0% wt together of tin and lead. The process includes the steps ofpartially oxidizing a first liquid bath having the first lead-tin based metal composition, thereby forming a first dilute copper metal composition and a first solder refining slag, followed by separating the slag from the metal composition, andpartially oxidizing a second liquid bath having the first dilute copper metal composition, thereby forming a first high-copper metal composition and a third solder refining slag, followed by separating the third solder refining slag from the first high-copper metal composition,whereby the solder product is derived from the first solder refining slag.
Inventors:
Colletti, Bart
Goris, Jean, Dark, A.
De Visa, Eve
Zinen, Charles
Guns, Walter
Moren, Nico
Smetz, Stephen
Belgermans, Andy
Goris, Jean, Dark, A.
De Visa, Eve
Zinen, Charles
Guns, Walter
Moren, Nico
Smetz, Stephen
Belgermans, Andy
Application Number:
JP2020531996A
Publication Date:
May 15, 2023
Filing Date:
December 11, 2018
Export Citation:
Assignee:
Aurbis Bease
International Classes:
C22B25/02; C22B7/04; C22B13/02; C22B15/06; C22C9/02; C22C9/08; C22C11/04; C22C11/06; C22C13/00
Domestic Patent References:
| JP2005503481A | ||||
| JP2009209405A | ||||
| JP2017201048A |
Foreign References:
| US4678507 |
Attorney, Agent or Firm:
Patent Attorney Corporation Hiroe Associates Patent Office