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Patent Searching and Data


Title:
IN-MOLD MOLDED BODY AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2008030392
Kind Code:
A
Abstract:

To provide an in-mold molded body having a high corona generating voltage, a narrow interval between metal plates, and an easy assembling work, and its manufacturing method.

The in-mold molded body is manufactured by providing layers 1 of adhesive materials on both faces of an insulating polymer film 2, bonding sheet-like metal bodies 3 on the layers 1 of the adhesive materials, and molding the two faces with outer layer insulating polymers 6 in a mold. When the sheet-like metal bodies 3 are bonded on the insulating polymer film 2, the adhesion is performed so that the end parts 5 of the sheet-like metal bodies 3 are covered with the adhesive materials, and thereafter, the surroundings of these bonded articles are molded with the outer layer insulating polymers 6 in the mold.


Inventors:
IWASAKI SHU
YAMAZAKI TAKANORI
TAKI TAKEYOSHI
Application Number:
JP2006208359A
Publication Date:
February 14, 2008
Filing Date:
July 31, 2006
Export Citation:
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Assignee:
HITACHI CABLE
International Classes:
B32B15/08; B29C43/18; B29C43/20; H01B17/62; H01B19/00; B29K105/22
Domestic Patent References:
JP2005032465A2005-02-03
JP2001196741A2001-07-19
Attorney, Agent or Firm:
Nobuo Kinutani