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Title:
IN-SITE CAP AND METHOD FOR MANUFACTURING IN-SITE CAP FOR INTEGRATED CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JP2006326834
Kind Code:
A
Abstract:

To provide an improved in-site cap for an integrated circuit device including a micro machine device, a method for manufacturing the in-site cap, and provide such a cap and a method of using a basic IC circuit manufacturing process for manufacturing the cap.

The method for manufacturing the in-site cap (40) comprises the steps of forming an integrated circuit element (122) on a substrate (14) and the in-site cap for the integrated circuit device (10) such as a micro-machine, forming a support layer (124) on the integrated circuit element (122) and forming a cap structure (22) on the support layer (124) covering the integrated circuit element (122).


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Inventors:
MARTIN JOHN R
MORRISON JR RICHARD H
Application Number:
JP2006217336A
Publication Date:
December 07, 2006
Filing Date:
August 09, 2006
Export Citation:
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Assignee:
ANALOG DEVICES INC
International Classes:
B81C1/00; B81B3/00; B81B7/00; H01H57/00; H01H59/00; H01L21/3205; H01L21/768; H01L23/02; H01L23/52; H01L23/522
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro



 
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