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Title:
Increased etching system productivity by managing polymers
Document Type and Number:
Japanese Patent JP6362670
Kind Code:
B2
Abstract:
Embodiments described herein generally relate to an apparatus and methods for reducing the deposition of polymers in a semiconductor processing chamber. A heater jacket and heat sources are provided and may be configured to maintain a uniform temperature profile of the processing chamber. A method of maintaining a uniform temperature profile of a dielectric ceiling of the processing chamber is also provided.

Inventors:
Chevy robert
Granados Alfredo
Demonte Peter
Chen Jiao H
One jean
Valesan Rajan
Application Number:
JP2016500157A
Publication Date:
July 25, 2018
Filing Date:
January 06, 2014
Export Citation:
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Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/3065; H01L21/31
Domestic Patent References:
JP10149899A
JP8321492A
JP2005311357A
JP5275379A
JP2008311346A
JP10163180A
JP8124866A
Attorney, Agent or Firm:
Takaki Nishijima
Disciple Maru Ken
Shinichiro Tanaka
Fumiaki Otsuka
Hiroyuki Suda
Hiroshi Uesugi
Naoki Kondo
Nobuhiko Suzuki