To prevent solder balls from being solidified on lead terminals even if solder is molten to turn into the solder balls and to prevent a short-circuit between wirings from being caused by a peeling-down of the solder balls from the lead terminals by a method wherein the solder having a solid phase line temperature higher than the soldering temperature of a solder, which is used at the time of mounting an inductor on a wiring board, is used.
A winding wire 2 is wound on a wire-wound core part of a drum-shaped magnet core 1 and lead terminals 3 with a circular section are respectively planted on both end surfaces of the core 1 in the axial direction of the core 1. Both terminals of the wire 2 are respectively wrapped on the joints of the terminals 3 and 3 and are soldered with a solder 4. Here, as the solder 4 for the wrapping parts of the terminals 3, a solder of a temperature higher than the soldering temperature of about 230°C of an eutectic solder (have a composition of 63% of Sn and 37% of Pb) which is normally used at the time of mounting an inductor on a wiring board, such as a high- temperature solder having a solid phase line temperature of about 268°C and a liquid phase line temperature of about 301°C, that is, a solder having a composition of 10% of Sn and 90% of Pb is used.
| JP2022520617 | Coil and manufacturing method of the coil |
| JPH0645306 | [Name of invention] Coil device |
OTSUKA KAZUHIKO
IGAWA IZUMI
