To provide information equipment for efficiently cooling electronic components without substantially warming electronic components whose heat generation is low by the heat of electronic components whose heat generation is high.

An upper portion chassis 7 made of metal is disposed in a front case 5 of an equipment main body 1, a circuit substrate 10 with many electronic components 15 mounted thereon is attached on the chassis 7, a radiating member 11, made of metal with high heat conductivity, surrounding and covering the substrate 10, is attached on the chassis 7, and a blowing air fan 9 is attached at a bowing air opening 32 disposed at a rear case 6 of the main body 1. Accordingly, a radiating member 11 absorbs the heat generated from the components 15 on the substrate 10 to radiate the heat outside the member 11, and cools the outer surface of the member 11 by open air blown from the fan 9. Thereby, the fan 9 does not flow the heat of electronic components 15a-15f whose heat generation is high into the member 11, hardly warms the electronic components whose heat generation is low, and efficiently cools the components 15.