PURPOSE: To prevent electric discharge from a metallic frame, charged with static electricity, to a lower side wiring pattern without enlarging the size of an information medium, having the shape of a coin provided with the metallic frame.

CONSTITUTION: A lower side wiring pattern 2 is formed at a part excluding the outer peripheral part of the lower surface of a substrate 1. As a result, an interval (t1) between the outer end surface of the lower side wiring pattern 2 and the internal peripheral surface of a metallic frame 8 can be enlarged without increasing an interval (t2) between the outer peripheral surface of the substrate 1 and the inner peripheral surface of the metallic frame 8. Accordingly, electric discharge from the metallic frame 8, charged with static electricity, to the lower side wiring pattern 2 can be prevented without increasing the size of an information medium itself whereby the electrostatic destruction of an IC chip 4 can be prevented.