Title:
DICING MACHINE
Document Type and Number:
Japanese Patent JP3153031
Kind Code:
B2
Abstract:
PURPOSE: To embody a dicing machine in which contamination of the machine and its periphery due to scattering of cutting liquid to be supplied to a cutting part by a grindstone cutter is prevented and the liquid contaminated at the cutting part is prevented from being again supplied.
CONSTITUTION: The dicing machine comprises a grindstone cutter 1 rotated at a high speed to form a thin groove and a cutting liquid supply pipe 3 provided substantially parallel to the cutter 1 to supply cutting liquid to the cutting part, wherein the pipe 3 is extended to the cutting part from a front side in a rotating direction with respect to the part. Further, the machine comprises a cutting liquid scatter preventing restrictor plate 4 of an inclination to lower a horizontal or the cutter 1 side to a rear side of the rotating direction to the part by a width of a diameter or less of the cutter 1.
Inventors:
Tomoyuki Tanaka
Jiro Tsuchishima
Jiro Tsuchishima
Application Number:
JP847293A
Publication Date:
April 03, 2001
Filing Date:
January 21, 1993
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
H01L21/301; H01L21/78; (IPC1-7): H01L21/301
Domestic Patent References:
| JP56121527U | ||||
| JP315064U | ||||
| JP60123210U | ||||
| JP422206U | ||||
| JP57170925U | ||||
| JP3815994Y1 |
Attorney, Agent or Firm:
Shoichi Ui (4 others)