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Title:
赤外線焼成装置及びこれを用いた電子部品の焼成方法
Document Type and Number:
Japanese Patent JP6767028
Kind Code:
B2
Abstract:
To provide an infrared firing device capable of easily adjusting a temperature profile upon firing, and, while capable of performing batch treatment to a large quantity of fired products, capable of uniformly retaining a gas atmosphere to be fed to the fired products, and a method for firing an electronic component using the same.SOLUTION: Provided is an infrared firing device comprising: a furnace chamber in which an opening part can be opened/closed by an opening/closing cover and internal space can be sealed; a fired product mounting part 34 mounted with fired products and capable of taking in-out from the opening part; a heater lamp 31 heating the fired products by infrared rays; a gas feed port 30 capable of feeding a gas into the furnace chamber; and a gas exhaust port 35 capable of exhausting the gas from the furnace chamber. The furnace wall of the furnace chamber collects the infrared rays of the heater lamp 31, and applies the same to the fired product mounting part 34. The fired product mounting part 34 being a wide tray 34. The gas feed port 30 flows down the gas from a plurality of places at the upper part of the tray 34 toward the tray 34. Gas exhaust ports 35, 35 are provided on both the horizontal sides of the tray 34 and exhaust the flowed-down gas.SELECTED DRAWING: Figure 7

Inventors:
Yasuhiro Onishi
Ibusuki Sadayuki
Application Number:
JP2018241548A
Publication Date:
October 14, 2020
Filing Date:
December 25, 2018
Export Citation:
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Assignee:
Yonekura Manufacturing Co., Ltd.
div corporation
International Classes:
F27D11/02; F27B17/00; F27D3/12; F27D7/02; F27D21/02; H01G13/00
Domestic Patent References:
JP7130677A
JP2012104808A
JP60031000U
JP2006315927A
JP2004060991A
Attorney, Agent or Firm:
Koji Kitamura
Toshio Takao