PURPOSE: To improve the mechanical and electrical connection between component structures of a hybrid solid system.
CONSTITUTION: A heat insulation structure 50 to electrically connect and mechanically bond a focal plane array 30 of a temperature sensor 40 is arranged on an integrated circuit substrate 70, and extended from mesa-type structures 52, 54 to adjacent contact pads 72, 74, and at least one of mesa conductors 56, 58 to guide the bias voltage for a temperature sensor, and its sensor signal route is provided. When the focal plane array 30 is bonded to the corresponding mesa-type structures 52, 54, a heat insulating and electrically conductive route is provided between electrodes 43, 45 of the temperature sensor 40 and the corresponding contact pads 72, 74 of the integrated circuit substrate 70.
ROBAATO EI OOUEN
CHIYAARUZU EMU HANSON
HAWAADO AARU BERATAN
