Title:
INFRARED-RAY HEATER AND SOLDERING DEVICE USING INFRARED-RAY HEATER
Document Type and Number:
Japanese Patent JP3205301
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a large infrared-ray heater, which can obtain the even temperature distribution, by providing a resistor heating body under a heat conductive plate provided on a heat insulating plate, and providing an infrared-ray radiating layer on the top surface of the resistor heating body, and providing a buffer layer having a thermal expansion coefficient at an intermediate value between the heat conductive plate and the infrared-ray radiating layer.
SOLUTION: A sheath heater 53 is inserted into a groove formed in a lower surface of a plate of Al, Mo, Cu, graphite, AlN or the like so as to obtain a heat conductive plate 52 having a thermal conductivity at 50 W/(m.K) or more. This heat conductive plate 52 is arranged on a heat insulating plate 51, and an infrared-ray radiating layer 55, which receives the heat from the heat conductive plate 52 and which radiates the infrared-ray, is formed thereon through a buffer layer 54. This infrared-ray radiating layer 55 is composed of ZrO2, Al2O3, TiO2, Cr2O3, SiO2, NiO or the like, and surface roughness thereof is set at 2 μm or less, and this infrared-ray radiating layer 55 desirably has the radiation spectrum, which shows the maximum in a wavelength area at 5-8 μm. A thermal expansion coefficient of the buffer layer 54 is set at an intermediate value between the heat conductive plate 52 and the infrared-ray radiating layer 55.
Inventors:
Masaki Sakuyama
Hiroki Uchida
Isao Watanabe
Hiroki Uchida
Isao Watanabe
Application Number:
JP17006698A
Publication Date:
September 04, 2001
Filing Date:
June 17, 1998
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05B3/10; B23K1/005; F27D11/02; H05B3/62; H05K3/34; (IPC1-7): H05B3/10; B23K1/005; F27D11/02; H05B3/62; H05K3/34
Domestic Patent References:
| JP607095A | ||||
| JP432184A |
Attorney, Agent or Firm:
Shintaro Nogawa